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E&A 2019 Utrecht: TPT Wire Bonder Demonstrations

Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7C113.
Bring your sample for a test wire bonding!

The HB16 Semi-Automatic series bench top size wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

TPT – HB16

  • Wedge, Ball & Ribbon bonding
  • Gold, aluminium, silver & copper wire.
  • Repeatable Loop profiles
  • Motorized wireclamp
  • User friendly concept
  • Very flexible solution for proto & low volume
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PS: On our booth you will also find solutions for EMC and RF testing, X-Ray and CT Inspection, Non contact surface measurements and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).

Click to register your free ticket. Visit us at stand 7C113